LGA THIN FILMS ®
VACUUM DEPOSITION SPECIALISTS
3064 Lawrence Expressway, Santa Clara, CA 95051
(408)733-3076    info@lgathinfilms.com


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SPUTTERING

Sputtering is the process of bombarding a material with heavy atoms or ions with sufficient energy to dislodge the material thus allowing it to transfer to a different location. The high voltage creates a charge at the target surface and at the same time strips an electron from the sputtering gas (usually argon). Since the target has the opposite charge to the argon ion, the ions are attracted to the target and sputtering takes place as the argon ions impact the surface. It can be thought of as atomic level billiard balls.


MATERIALS INVENTORY - Deposition materials presently in our inventory, or which we are able to produce by reactive processes, include the following:

  Sputtered Films
Conductive metals Al, Au, Ag, Cu
Aluminum alloys Al-1%Si, Al-.5%Si, Al-1%Cu
Al-1%Cu-1%Si Al-1%Cu-.5%Si
Adhesion metals Cr, Ti, Ti-90%W
Refractory metals Mo, Nb, Ta, W, Hf
Platinum group metals Pt
Magnetic metals Ni, Fe, Co, Co-20%Cr
Non-magnetic alloys Ni-20%Cr, Ni-7%V
Other alloys Ti-50%Ni, CoCrAlY
Semiconductors Si, Ge
Nitrides (reactively sputtered) SiN, TiN, TaN, TaSi2N, Ta5Si3N, BN
Oxides SiO2, Al2O3, TiO2, CrSiO, AZO, GlTO, YSZ, Borosilicate
TCO ITO
Carbon, Carbide C, SiC
Silicides TaSi2, Ta5Si3
Chalcogenide Ge2Sb2Te5

New materials may be added upon request.



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